第五届先进功能材料国际研讨会(CAFM 2024)

会议时间： 2024年8月9-11日
会议地点：中国 成都
会议官网：https://www.academicx.org/CAFM/2024/

会议日期：2024年8月9-11日
会议地点：中国 成都(线下会议)
稿件提交截止日期：2024年7月20日
报名截止日期：2024年7月20日
 
会议简介：
第五届先进功能材料国际研讨会(The 5th Int'l Conference on Advanced Functional Materials ，简称为CAFM 2024)将于2024年8月9-11日在中国成都举行。本届大会囊括功能材料的应用，功能材料，发光和辐射传感材料，功能材料物理学，智能材料，智能结构和材料等领域相关议题。会议将集聚来自世界各地的科研人员、工程师、学者及业界专家，展示他们在先进功能材料相关领域的最新研究成果及活动进展。
  
会议论文发表

 录用的论文将发表在国际英文开源期刊Journal of Materials Science and Chemical Engineering (ISSN Print: 2327-6045/ISSN Online: 2327-6053)上。

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感兴趣的提交主题包括但不限于：
功能材料
功能材料及其应用
功能材料物理学
功能材料的应用
自适应材料和结构
仿生智能材料与系统
分类和排序
导电材料
纳米材料
碳基材料
电光和磁光材料
用情报材料保护环境
可持续发展的绿色材料与技术
硬磁性和软磁性材料
发光和辐射传感材料
磁性、光学和催化性能
磁弹性和自适应材料
医疗应用材料；生物传感器
自旋电子学和光子学材料
活性材料的力学与性能
微波和太赫兹材料；超材料
多元铁电与磁电材料
多功能材料
智能材料
能源材料
功能材料的纳米技术
材料研究的新技术和新设备
光纤和半导体材料
相位和晶体
功能材料的现象学性质
形状记忆材料
其他相关主题
特邀演讲嘉宾

Prof. Dr. Mohd Nazri Bin Ismail
National Defence University of Malaysia, Malaysia
Biography:
Prof. Dr. Mohd Nazri became Lecturer at National Defence University of Malaysia. Prof. Dr. Mohd Nazri Ismail had a deep involvement in computer network research and was awarded the prestigious “Educator Award 2009 – R&D/Education category” by MARA (Malaysia Agency). He has supervised Ph.D. and Master Students and teaching at undergraduate and post graduate level. Assoc. Prof. Dr. Mohd Nazri Ismail has published more than 100 papers in national and international journals (indexed  ISI, SCOPUS, IET) and IEEE conferences. 
He has attended many international conferences throughout the world and has chaired many technical sessions. He has appointed as Technical Program Committee and organized more than 60 national and international conferences. He has appointed as Editorial Board member more than 90 international journals and 40 international reviewer panels (journal/proceeding). Awards and laurels won by Assoc. Prof. Dr. Mohd Nazri Ismail run into volumes and he has received 28 awards in R&D/Education. Assoc. Prof. Dr. Mohd Nazri Ismail is an International Association of Engineers (IAENG), IEEE Cloud Computing Community, Society of Digital Information and Wireless Communications (SDIWC), International Association of Engineers and Scientists (IAEST), Universal Association of Computer & Electronics Engineers (UACEE).

Dr. Chunfu Chen
Henkel Technology Center – Asia Pacific, Henkel Japan Ltd., Japan
Biography:
Dr. Chunfu Chen is currently Senior Scientific Principal Epoxy of Henkel Adhesive Technologies, the world’s number one producer in adhesives, sealants, and functional coatings. He is responsible for new adhesive product development, new epoxy technology research, and providing technical advice as the leading expert to corporate internal teams and external partners especially related to epoxy adhesive technology. Dr. Chen is based at Henkel Technology Center – Asia Pacific, located in Yokohama, Japan. 
He has abundant research experience, with over 35 years, in polymer science and material areas especially on epoxy adhesive technology. His technical expertise lies in the areas of new product development and new technology research, ranging from room temperature cure epoxy adhesives, heat cure epoxy adhesives, light cure epoxy adhesives, and light cure acrylic adhesives as well as latent curing agent for epoxy resin. Dr. Chen has contributed to very successful development on various new adhesive products for electronic assemblies such as camera module bonding, LCD ODF panel sealing, display module assembly, and touch panel LOCA. He has also contributed to successful development on many new adhesive products for general industry applications such as general manufacturing structural bonding, maintenance and repair protective coating. 
D. Chen received his Bachelor of Science in Chemistry in 1985 and his Ph.D. in Polymer Chemistry in 1990 from Nankai University in Tianjin, China.  After completing his Ph.D., he became Assistant Professor at Nankai University and had been a visiting researcher for 1 and half year from 1991 to 1993 at Sophia University in Tokyo, Japan. Dr. Chen has invented 37 patents with 22 granted already. He has also published more than 40 international conference, research, and review articles. Recently Dr. Chen has authored a new scientific book ‘Instant Bonding Epoxy Technology’, to be published soon by Bentham Science.
 

Prof. Natalia Resnina
Saint-Petersburg State University, Russia
 
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该学术会议为网页翻译，学术会议内容可能会有差异，一切以官网为准-会议官网：https://www.academicx.org/CAFM/2024/